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Contents of business
Low dielectric material for 5G NEW!
Spatter material for MSAP
Alternative material to LCP
Materials for millimeter-wave radar, etc.
Surface Treatment Chemicals
Electroless Copper Plating Process
Electro Gold Plating Process etc.
New and Renewal Facility Layout Design and Producing Machine and Chemicals
Production control, Manufacturing control and QC System
Market Research etc.
Ultra-thin Electrolytic Copper Foil
Release Film etc.
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